Polyimide (PI) and Polybenzoxazole (PBO) products are typically used as a stress relief and protective insulating layer before packaging or redistribution layer (RDL). PI and […]
Soldering is a joining process used to join metal with an alloy material that has lower melting temperature than the joining metal with the application […]
Electromigration is a mass transport process due to momentum exchange between the mobile valence electrons and atoms (ions). During the current flow in the conductor, […]
Chip package interaction (CPI) is the interaction between semiconductor package stresses and semiconductor devices. Polyimide (PI) acts as a package stress buffer & protects the […]
The journey of a semiconductor integrated chip (IC) begins with the design of the IC, manufacturing of the wafer by imprinting the circuits and devices […]
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