Solder Joint Fundamentals in Wafer Bumping & Packaging
Soldering is a joining process used to join metal with an alloy material that has lower melting temperature than the joining metal with the application […]
IC Packaging Reliability
Electromigration in WLCSP Packaging
Electromigration is a mass transport process due to momentum exchange between the mobile valence electrons and atoms (ions). During the current flow in the conductor, […]